The use of Solder Fortification Preforms will add more solder volume and help obtain the correct amount of solder therefore ensuring a much strong solder joints. This is particularly useful in situations where there is reduced stencil thickness, such as those with a pitch of 0.3mm or less or where there are tightly fitted components, which is now becoming the norm within the SMT industry as the miniturization trend shows no signs of slowing.
Preforms are generally rectangle or disc shaped pieces of alloyed metal that do not contain any flux. The perform is packaged on tape and reel and added to a deposit of solder paste using standard pick and place equipment. Since the alloy for both the perform and past are the same, the perform reflows at the same temperature as the paste and the paste in turn provides the necessary flux. The preform increases the volume of solder above that of the paste alone.
SMT Industrial offers a wide selection of shapes and sizes of tape and reel solder preforms. Contact us for available sizes and pricing.
- Increased Solder Volume
- Stronger solder joints for improved drop test results
- Fewer issues with flux residue
- Reduced Rework
- Improved fillet shape and volume ensures joints meet IPC specifications
Common Alloys: SAC 305, SAC 387, Sn63, Sn62, BiSn, BiSnAg
Quantity per 7” Reel
Quantity per 13” Reel
Example Weight SAC 305 (Grams/Each)
.010” x .020” x .010” rectangle
.020” x .040” x .020” rectangle
.030” x .060” x .030” rectangle
.050” x .080” x .050” rectangle
Download Our Solder Fortification Design Guide: Solder Fortification Guide