Durafuse LT
Low Temp Solder Paste

$195.00

Durafuse LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup. Durafuse LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse LT is ideal for high-reliability applications, which utilize thermally sensitive components or boards and/or have a requirement for step soldering.

Contact us for pricing and alloy/particle size selection.

Description

Durafuse LT is a low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C.

Durafuse LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup. Durafuse LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse LT is ideal for high-reliability applications, which utilize thermally sensitive components or boards and/or have a requirement for step soldering.

Contact us for pricing and alloy/particle size selection.

Features:

  • Excellent drop shock reliability—comparable to SAC
  • Reflow below 210°C
  • Melting temperature above 180°C
  • Good mechanical shear strength up to 150–165°C
  • Good thermal and electrical conductivity
  • Not as brittle as other low temperature solder pastes

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Low Temp Solder Paste”

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